APA Style
ELFADEL, I, (, M., FETTWEIS, G. (2016).
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems .
:
Springer.
MLA Style
ELFADEL, Ibrahim, (Abe), M.., FETTWEIS, Gerhard.
"3D Stacked Chips: From Emerging Processes to Heterogeneous Systems".
:
Springer,
2016.
Text.