APA Style
QU, S., Liu, Y. (2015).
Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications .
:
Springer New York, NY.
MLA Style
QU, Shichun., Liu, Yong.
"Wafer-Level Chip-Scale Packaging
Analog and Power Semiconductor Applications".
:
Springer New York, NY,
2015.
Text.