APA Style

Liu, Y., SHICHUN, Q. (2015). Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications . : Springer New York, NY.

MLA Style

Liu, Yong., SHICHUN, Qu. "Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications". : Springer New York, NY, 2015. Text.