APA Style

HORIUCHI, S., TERASAKI, N. (2024). Interfacial Phenomena in Adhesion and Adhesive Bonding . Singapura, Singapore: Springer International Publishing.

MLA Style

HORIUCHI, Shin., TERASAKI, Nao. "Interfacial Phenomena in Adhesion and Adhesive Bonding". Singapura, Singapore: Springer International Publishing, 2024. Text.