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Found 1 from your keywords: author="Qingke Zhang"
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free …
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Qingke Zhang

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time…

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978-3-662-48823-2
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