Filter by

  • Publication Year
  • Availability
  • Attachment
  • Collection Type
  • General Material Designation
    See More
  • Location
  • Language
Found 1 from your keywords: author="Randy Hsiao - Yu Lo"
cover
Semiconductor Packaging: Materials Interaction and Reliability
Comment Share
Andrea ChenRandy Hsiao - Yu Lo

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to …

Edition
-
ISBN/ISSN
9781439862070
Collation
-
Series Title
-
Call Number
-