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Three-Dimensional Integration of Semiconductors

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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Detail Information
Series Title
-
Call Number
-
Publisher
: .,
Collation
191 b/w illustrations, 269 illustrations in colour
Language
English
ISBN/ISSN
978-3-319-18675-7
Classification
NONE
Content Type
-
Media Type
computer
Carrier Type
online resource
Edition
-
Subject(s)
Electrochemistry
Semiconductors
Electrical and Electronic Engineering
Specific Detail Info
-
Statement of Responsibility
Other Information
Cataloger
Yd
Source
-
Other version/related

No other version available

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