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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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Detail Information
Series Title
-
Call Number
712 THR t
Publisher
: Springer.,
Collation
-
Language
English
ISBN/ISSN
978-3-319-20481-9
Classification
712
Content Type
text
Media Type
computer
Carrier Type
online resource
Edition
-
Subject(s)
Electronic Circuits and Systems
Processor Architectures
Specific Detail Info
-
Statement of Responsibility
Other Information
Cataloger
umi
Source
https://link.springer.com/content/pdf/10.1007/978-3-319-20481-9.pdf?pdf=button
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