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Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications

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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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Detail Information

Series Title

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Call Number

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Publisher

: Springer Cham., 2015

Collation

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Language

English

ISBN/ISSN

978-3-319-18675-7

Classification

NONE

Content Type

text

Media Type

computer

Carrier Type

online resource

Edition

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Subject(s)

Mechanical Engineering
Biomedical Engineering and Bioengineering
Electrochemistry
Semiconductors
Electrical Engineering

Specific Detail Info

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Statement of Responsibility

Kazuo Kondo, Morihiro Kada, Kenji Takahashi

Other Information

Cataloger

Yudi

Source

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Validator

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Digital Object Identifier (DOI)

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Journal Volume

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Subtitle

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