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Fundamentals of Lead-Free Solder Interconnect Technology

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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Publisher

New York : Springer., 2014

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Language

English

ISBN/ISSN

978-1-4614-9266-5

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NONE

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Statement of Responsibility

Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

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Cataloger

Jemadi

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Validator

Jemadi

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