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Arbitrary Modeling of TSVs for 3D Integrated Circuits

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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Detail Information

Series Title

Analog Circuits and Signal Processing

Call Number

621.38 SAL a

Publisher

Cham, Switzerland : Springer Cham., 2015

Collation

IX, 179

Language

English

ISBN/ISSN

978-3-319-07611-9

Classification

621.38

Content Type

text

Media Type

computer

Carrier Type

online resource

Edition

Ed. 1

Subject(s)

Electronics and Microelectronics
Circuits and Systems

Specific Detail Info

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Statement of Responsibility

Khaled Salah, Yehea Ismail, Alaa El-Rouby

Other Information

Cataloger

umi

Source

https://link.springer.com/book/10.1007/978-3-319-07611-9

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