This volume contains thirty-nine revised and extended research articles, written by prominent researchers participating in the World Congress on Engineering and Computer Science 2014, held in San Francisco, October 22-24 2014. Topics covered include engineering mathematics, electrical engineering, circuit design, communications systems, computer science, chemical engineering, systems engineerin…
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many…