Filter by
Found 1 from your keywords: author="SHICHUN, Qu"
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor conte…
- Edition
- -
- ISBN/ISSN
- 978-1-4939-1556-9
- Collation
- -
- Series Title
- -
- Call Number
- -
Computer Science, Information & General Works 
Philosophy & Psychology 
Religion 
Social Sciences 
Language 
Pure Science 
Applied Sciences 
Art & Recreation 
Literature 
History & Geography