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Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor conte…
- Edition
- -
- ISBN/ISSN
- 978-1-4939-1556-9
- Collation
- -
- Series Title
- -
- Call Number
- -
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor conte…
- Edition
- -
- ISBN/ISSN
- 978-1-4939-1556-9
- Collation
- XVII, 322
- Series Title
- -
- Call Number
- -
Passive and Active Measurement : 16th International Conference, PAM 2015, New…
This book constitutes the refereed proceedings of the 16th International Conference on Passive and Active Measurement, PAM 2015, held in New York, NY, USA, in March 2015. The 27 full papers presented were carefully reviewed and selected from 100 submissions. The papers have been organized in the following topical sections: DNS and Routing, Mobile and Cellular, IPv6, Internet-Wide, Web and Peer-…
- Edition
- -
- ISBN/ISSN
- 978-3-319-15509-8
- Collation
- XI, 374 halaman
- Series Title
- Lecture Notes in Computer Science
- Call Number
- 004 PAS
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