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Found 1 from your keywords: author=ELFADEL, Ibrahim (Abe) ...
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
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ELFADEL, Ibrahim (Abe) M.FETTWEIS, Gerhard

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emergi…

Edition
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ISBN/ISSN
978-3-319-20481-9
Collation
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Series Title
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Call Number
712 THR t