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Semiconductor Packaging: Materials Interaction and Reliability

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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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Detail Information

Series Title

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Call Number

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Publisher

: ., 2016

Collation

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Language

English

ISBN/ISSN

9781439862070

Classification

NONE

Content Type

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Media Type

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Carrier Type

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Edition

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Subject(s)

Technology & Engineering / Electronics

Specific Detail Info

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Statement of Responsibility

Andrea Chen, Randy Hsiao - Yu Lo

Other Information

Cataloger

Kholif Basri

Source

https://openresearchlibrary.org/content/81714460-25bb-4a0b-a4dc-1c74c9e44095

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