OPEN EDUCATIONAL RESOURCES

UPA PERPUSTAKAAN UNEJ | NPP. 3509212D1000001

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Found 163 from your keywords: subject="its"
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cover
Engineering Safe and Secure Cyber-Physical Systems the Specification Pearl A…
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GUMZEJ, Roman

This book introduces the concept of holistic design and development of cyber physical systems to achieve their safe and secure operation. It shows that by following the standards for embedded system’s safety and using appropriate hardware and software components inherently safe system’s architectures can be devised and certified. While the standards already enable testing and certification…

Edition
-
ISBN/ISSN
978-3-319-28905-2
Collation
28 b/w illustrations
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-
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cover
The anthropocene cookbook :recipes and opportunities for future catastrophes
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Cerpina, Zane,Stenslie, Stahl,

"The Anthropocene Cookbook is by far the most comprehensive collection of ideas about future food from the perspective of art, design, and science. The book is unique in the way it connects food, art, thinking, and science. It talks to the new generation of aesthetically aware environmentalists. It promotes ecological thinking from a radically different perspective: what happens if we embrace t…

Edition
-
ISBN/ISSN
9780262371643
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1 online resource
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-
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-
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cover
Programming your GPU with OpenMP :performance portability for GPUs
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Deakin, Tom,Mattson, Timothy G.,

"OpenMP is a widely used language for programming the nodes in a parallel computer. Those nodes are now heterogeneous, including a GPU alongside the traditional CPU"--OCLC-licensed vendor bibliographic record.

Edition
-
ISBN/ISSN
9780262377720
Collation
1 online resource.
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-
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-
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cover
Sustainability of public debt
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Neck, Reinhard.Sturm, Jan-Egbert,

This collection is an analysis of the theoretical foundations of public debt sustainability concepts and their application to the empirical study of actual budgetary policies. The contributors to this volume consider whether the development of public debt in the United States and six EU countries is sustainable.OCLC-licensed vendor bibliographic record.

Edition
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ISBN/ISSN
9780262280495
Collation
1 online resource (vi, 271 pages) :illustrations.
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-
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cover
Iterative arrays of logical circuits
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Hennie, Frederick.

"MIT Press."An exploration of the techniques for analyzing the behavior of one- and two-dimensional iterative networks formed of discrete, or logical elements, showing that most questions about the behavior of iterative systems are recursively undecidable.Title from vendor webpage (IEEE Xplore; viewed on Feb. 14, 2013).An exploration of the techniques for analyzing the behavior of one- and two-…

Edition
-
ISBN/ISSN
9780262256322
Collation
1 online resource
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-
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-
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cover
Making microchips :policy, globalization, and economic restructuring in the s…
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Mazurek, Jan,

In Making Microchips, Jan Mazurek examines the environmental and economic implications of the computer microchip industry's exodus from California's Silicon Valley to New Mexico, Virginia, Ireland, and Taiwan. Globalization, economic restructuring, and changing manufacturing processes in this rapidly growing industry present difficult new questions for environmental policy. Mazurek challenges t…

Edition
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ISBN/ISSN
0585002797
Collation
1 online resource (xiv, 245 pages) :illustrations.
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-
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cover
Logic testing and design for testability
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Fujiwara, Hideo.

"Today's computers must perform with increasing reliability, which in turn depends on the problem of determining whether a circuit has been manufactured properly or behaves correctly. However, the greater circuit density of VLSI circuits and systems has made testing more difficult and costly. This book notes that one solution is to develop faster and more efficient algorithms to generate test p…

Edition
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ISBN/ISSN
0262256185
Collation
1 online resource (x, 284 pages) :illustrations.
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-
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-
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cover
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
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Liu, YongSHICHUN, Qu

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor conte…

Edition
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ISBN/ISSN
978-1-4939-1556-9
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-
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cover
Visual Signal Quality Assessment Quality of Experience (QoE)
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LIN, WeisiDENG, ChenweiLIN, MANGAN, King Ngi

This book provides comprehensive coverage of the latest trends/advances in subjective and objective quality evaluation for traditional visual signals, such as 2D images and video, as well as the most recent challenges for the field of multimedia quality assessment and processing, such as mobile video and social media. Readers will learn how to ensure the highest storage/delivery/ transmission q…

Edition
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ISBN/ISSN
978-3-319-10368-6
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-
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cover
Network-on-Chip: The Next Generation of System-on-Chip Integration
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Kundu, SantanuChattopadhyay, Santanu

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by a…

Edition
Ed. 1
ISBN/ISSN
-
Collation
389
Series Title
-
Call Number
621.38 KUN n
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